The **ATS-06A-01-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "Blue Ice" series, designed primarily for cooling electronic components such as processors, FPGAs, and ASICs. ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-06A-01-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 21.90°C/W @ (Natural Convection) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Component Features #### A. Thermal Interface Material (TIM) The "C2" suffix indicates that this model comes pre-applied with **T766 Phase Change Material**. * **Function:** It fills the microscopic air gaps between the heat sink base and the electronic component (CPU/GPU) to maximize heat transfer. * **Benefit:** Eliminates the need for external thermal paste application during assembly. #### B. Attachment Mechanism (Push-Pins) The "R0" designation refers to the mounting hardware. * **System:** It uses a brass or plastic push-pin with a compression spring. * **Functionality:** This provides consistent pressure (load) on the component, which improves thermal performance and ensures the heat sink remains secure during mechanical shocks or vibrations. #### C. Heat Sink Geometry * **Straight Fins:** The fins are arranged in a parallel, straight configuration. This is optimized for **forced air cooling** (where a fan is blowing air across the fins) but can also work in natural convection environments. * **Material:** Extruded aluminum is used for its excellent balance between thermal conductivity, weight, and cost. --- ### 3. Application Use-Cases This specific heat sink size (40x40mm) is standard for many electronic integrated circuits: * **Network Switches/Routers:** Cooling the main processing chipset. * **Industrial Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Used on development boards or SBCs (Single Board Computers). --- ### 4. Thermal Performance Data *Measured at different air flow rates (LFM - Linear Feet per Minute):* | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 12.10 | | 400 | 8.10 | | 600 | 6.20 | ---