The **ATS-06A-124-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling electronic integrated circuits (ICs) and other heat-generating components. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Here are the core electronic and physical attributes: | Feature | Specification | | :--- | :--- | | **Product Type** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.18°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding electronic components. | Dimension | Value | | :--- | :--- | | **Length (A)** | 50.00 mm | | **Width (B)** | 50.00 mm | | **Height (C)** | 25.00 mm | | **Fin Pitch** | Fine Pitch | | **Fin Pattern** | XCUT | --- ### 3. Electronic Design Considerations #### A. Thermal Resistance (Efficiency) This part is designed to dissipate heat from electronic chips (like CPUs, FPGAs, or MOSFETs). At a standard airflow of 100 LFM (Linear Feet per Minute), it provides a resistance of **3.18°C/W**. As airflow increases to 700 LFM, the resistance drops significantly to approximately **1.02°C/W**, allowing the underlying electronics to run at higher clock speeds without thermal throttling. #### B. Push-Pin Mounting System Unlike adhesive-based heat sinks, the `ATS-06A-124-C2-R0` uses a mechanical push-pin system. This is preferred in high-reliability electronics because: * It provides **consistent pressure** across the component surface. * It is resistant to vibration and shock. * The brass or plastic pins are designed for specific PCB hole patterns (in this case, a **43.00 mm x 43.00 mm** pitch). #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a phase-change thermal material. This eliminates the need for manual thermal paste application, reducing manufacturing variability and ensuring low contact resistance between the electronic package and the aluminum base. --- ### 4. Component Comparison The "C2" designation in the part number specifically refers to the material and finish: ```markdown ATS - 06 - A - 124 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Color/Finish (Blue Anodized) | | | +------------- Heat Sink Series | | +------------------ Attachment Type (pushPIN) | +----------------------- Series Number +---------------------------- Manufacturer (ATS) ``` ---