The **ATS-06A-129-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for thermal management in electronic components like CPUs, GPUs, and power modules. --- ### ## Technical Specifications Below are the primary electronic and mechanical specifications for this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 8.68°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Mounting Pattern** | 47.00mm (Center to Center) | --- ### ## Key Features & Components 1. **Material and Finish**: The body is made of extruded aluminum for optimal heat dissipation. The **Blue Anodized** finish provides a layer of electrical insulation and protects the aluminum from corrosion. 2. **Attachment Mechanism**: The "R0" suffix indicates a standard push-pin assembly. This mechanism uses pre-drilled holes in the PCB and integrated springs to provide consistent pressure (7-10 lbs) on the electronic component, ensuring a tight thermal interface. 3. **Thermal Performance (Airflow)**: The efficiency of the heat sink changes based on the Linear Feet per Minute (LFM) of airflow provided by system fans: * **@ 100 LFM:** 8.68°C/W * **@ 200 LFM:** 4.02°C/W * **@ 400 LFM:** 2.35°C/W 4. **Interface Material**: This specific part usually comes with **T766** thermal interface material (TIM) pre-applied to the base, which fills microscopic air gaps between the component and the heat sink. --- ### ## Typical Applications * **Integrated Circuits (ICs):** Cooling high-speed processors or ASICs. * **Networking Gear:** Used in routers and switches where airflow is directed. * **Industrial Power Supplies:** Managing heat in MOSFETs or voltage regulators. ---