The **ATS-06A-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 15.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 13.73°C/W (at 1.0 m/s airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Features The "C2" and "R0" designations in the part number refer to specific manufacturing and material standards: * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases the surface area for radiant and convective cooling while minimizing pressure drop. * **pushPIN™ Attachment:** This model uses a plastic or brass pin with a stainless steel spring. This ensures even pressure across the chip surface, which optimizes heat transfer. * **Blue Anodized Finish:** The surface treatment improves durability and emissivity, helping with radiation heat transfer. * **T766 TIM:** It comes with a high-performance thermal pad/paste pre-applied to the base, ensuring there are no air gaps between the component and the heat sink. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06** | Product Series (maxiFLOW) | | **A** | Material (Aluminum) | | **13** | Design/Height specific code | | **C2** | Color/Finish (Blue Anodized) | | **R0** | RoHS Compliant / Revision level | --- ### 4. Application Use-Case This part is typically used in **high-density electronic packaging** where space is limited but thermal loads are high. Common applications include: * Networking switches and routers. * Embedded computing modules. * Power supplies requiring passive or forced-air cooling. ---