The **ATS-06A-22-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Extruded) | | **Dimensions** | 58.2mm x 61mm | | **Height** | 14.5mm | | **Thermal Resistance** | 1.38°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Brass/Plastic) | | **Finish** | Blue Anodized | | **Thermal Interface** | T766 (Pre-applied Phase Change) | --- ### 2. Key Design Features #### A. maxiFLOW™ Geometry The "C2" in the part number refers to the specific fin design. The maxiFLOW™ geometry features a flared fin structure that maximizes surface area for radiant cooling while minimizing pressure drop. This is ideal for systems with high-velocity airflow. #### B. pushPIN™ Attachment This model uses the **pushPIN™** mounting system, which offers several advantages: * **Secure Fit:** Provides a consistent pressure of the heat sink against the component. * **Easy Installation:** Features a flexible, spring-loaded mechanism that snaps into pre-drilled holes on the PCB. * **Reliability:** Reduces the risk of the heat sink shifting during shipping or vibration. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance phase-change material. This ensures that the microscopic gaps between the heat sink and the electronic component are filled, significantly reducing thermal resistance compared to air gaps. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic environments: 1. **Telecommunications:** Cooling network switches and routers. 2. **Power Electronics:** Dissipating heat from high-wattage voltage regulators. 3. **Embedded Systems:** Used on motherboards where vertical space is constrained (due to its low 14.5mm profile). ---