The **ATS-06A-34-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc.* ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06A-34-C2-R0 | | **Type** | Board Level Heatsink (Top Mount) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.73°C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Fin Style** | Cross-Cut (Square Pin) | --- ### Key Components and Features #### 1. Material and Finish The unit is made from **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. #### 2. pushPIN™ Attachment System This part uses a proprietary attachment system consisting of: * **Brass Bolts/Pins:** Provide a secure mechanical connection to the PCB. * **Stainless Steel Springs:** Ensure constant, even pressure (compression) on the electronic component to maximize thermal interface material (TIM) performance. #### 3. Fin Design (Cross-Cut) The heatsink features a **Cross-Cut** pattern. Unlike straight-fin heatsinks, cross-cut fins allow for: * **Omnidirectional Airflow:** It can receive cooling air from any direction, making it ideal for cramped PCB layouts where airflow patterns are unpredictable. * **Increased Surface Area:** The "pin" structure maximizes the area available for heat dissipation into the air. #### 4. Thermal Interface Material (TIM) The "C2" in the part number typically denotes that it comes pre-applied with a high-performance thermal interface material (like T766) to ensure there are no air gaps between the chip and the aluminum base. --- ### Typical Applications * **Processors (CPUs/GPUs):** For small-scale embedded systems. * **FPGA & ASICs:** Cooling high-speed logic gates. * **Power Supplies:** Managing heat in voltage regulators. * **Telecommunications:** Networking gear that requires reliable passive or active cooling.