The **ATS-06A-40-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. Unlike active electronic components (like ICs), this is a passive mechanical part designed to manage the thermal output of electronic devices such as BGA (Ball Grid Array) processors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Product Category** | Heat Sink (Passive Cooling) | | **Series** | pushPIN™ | | **Base Dimensions** | 45.00 mm x 45.00 mm | | **Height** | 25.00 mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.45 °C/W (@ 100 LFM) | --- ## 2. Key Design Elements ### A. Material and Coating * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer protects the aluminum from corrosion and slightly improves heat radiation. ### B. The pushPIN™ Attachment System This specific model uses the **ATS pushPIN™** system, which is critical for PCB assembly: * **Spring-loaded mechanisms:** Ensures even pressure across the processor surface (TIM - Thermal Interface Material). * **Hardware:** It typically uses brass or plastic pins with stainless steel springs. * **Hole Pattern:** Designed for specific pitch requirements on a PCB to ensure stability during vibration or shipping. ### C. Thermal Performance (LFM - Linear Feet per Minute) The efficiency of the heat sink depends on the airflow provided by the system fan. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.45 | | 200 (1.0 m/s) | 0.90 | | 300 (1.5 m/s) | 0.70 | --- ## 3. Applications This part is commonly used in industrial and telecommunication hardware where high-density electronics generate significant heat: * **Networking Switches:** Cooling high-speed ASICs. * **Embedded Systems:** For industrial PCs (IPCs) or automation controllers. * **Power Supplies:** Cooling MOSFETs or power modules. --- ## 4. Complementary Parts To use this part in an electronic assembly, you typically require: 1. **Thermal Interface Material (TIM):** Pre-applied phase-change material or thermal grease to bridge the gap between the chip and the heat sink. 2. **PCB Mounting Holes:** The circuit board must be designed with specific drill holes to accommodate the push-pin spacing.