The **ATS-06A-46-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Straight Fin (High Density) | | **Attachment Type** | Push Pin (with 27.0mm hole spacing) | | **Dimensions (L x W x H)** | 25mm x 25mm x 25mm | | **Thermal Resistance** | 11.57°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (High Performance Phase Change) | --- ### 2. Design Components The "electronic parts" of this assembly are not active circuits, but rather mechanical-thermal components engineered for high-reliability heat dissipation: * **Heat Sink Body:** Extruded aluminum optimized for surface area. The high-aspect-ratio fins are designed to maximize heat transfer to the surrounding air. * **Push Pin Mechanism:** Uses a spring-loaded brass or plastic pin. This ensures consistent pressure (clamping force) against the electronic chip, which is critical for maximizing thermal conductivity. * **T766 Phase Change Material (PCM):** Pre-applied to the base. This material softens when heated, filling microscopic air gaps between the chip and the heat sink to reduce thermal resistance. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **06** | Part Series (Push Pin Heat Sink) | | **A** | Aluminum Material | | **46** | Specific Fin Density/Design Configuration | | **C2** | Thermal Interface Material Code (T766) | | **R0** | RoHS Compliance Revision | --- ### 4. Application Use Cases This part is typically used in the following electronic environments: 1. **Networking Hardware:** Cooling high-speed controllers in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but vertical clearance is available (25mm height). 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.