The **ATS-06A-75-C3-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "push pin" series. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push Pin (Spring-loaded) | | **Thermal Resistance** | 15.02°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Detailed Component Breakdown #### A. The Heat Sink Body * **Material:** The 6063 aluminum alloy provides a high thermal conductivity-to-weight ratio. * **Finish:** The blue anodized finish is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiative cooling. * **Profile:** The 10mm height is a "low profile" design, making it suitable for compact enclosures or 1U server rack applications. #### B. Attachment Mechanism (Push Pins) Instead of adhesive tapes which can degrade over time, the **-R0** series uses brass or plastic push pins with stainless steel springs. * **Consistency:** The springs ensure a precise and constant pressure (clamping force) on the chip, optimizing the contact between the heat sink and the heat source. * **Reliability:** Mechanical mounting is preferred in high-vibration environments compared to thermal tape. #### C. Thermal Interface Material (TIM) * The unit comes with **T412** pre-applied to the base. * This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink to maximize heat transfer. --- ### 3. Application Use Cases This component is typically used in: 1. **Networking Hardware:** Switches, routers, and gateways. 2. **Processors:** Cooling for BGAs (Ball Grid Arrays) and FPGAs. 3. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. 4. **Embedded Systems:** Industrial PCs where airflow might be constrained. --- ### 4. Part Number Decoding The suffix **-C3** refers to the specific performance class and attachment kit (often indicating a specific spring tension or pin material), while **-R0** denotes the revision and packaging standard.