The **ATS-06A-80-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 30mm x 30mm x 25mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 7.03°C/W @ 200 LFM | | **Spring Type** | Compression Spring | --- ### 2. Design Characteristics This component is engineered for efficient heat dissipation in compact environments: * **Straight Fin Geometry:** This design provides a large surface area for airflow. It is most effective when used with a dedicated cooling fan or within a chassis with forced air convection. * **Blue Anodization:** The surface treatment is not just for aesthetics; the anodized layer increases emissivity and provides a degree of corrosion resistance and electrical insulation. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This ensures consistent pressure against the chip, improving the effectiveness of the Thermal Interface Material (TIM). --- ### 3. Application Use Cases The **ATS-06A-80-C2-R0** is typically used on the following types of electronic parts: * **Integrated Circuits (ICs):** Large FPGAs or ASICs used in networking equipment. * **Voltage Regulators:** High-power VRMs that generate significant waste heat. * **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is required. --- ### 4. Installation Requirements To use this part effectively, the PCB must have: 1. **Pre-drilled Holes:** Specifically spaced to match the 30mm footprint. 2. **Thermal Interface Material (TIM):** A thermal pad or paste must be applied between the chip and the heat sink base to fill microscopic air gaps.