The **ATS-06A-84-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed specifically for high-airflow cooling of electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | superGRIP (Clip-on) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Resistance** | 6.96°C/W @ 200 LFM | | **Flow Orientation** | Horizontal (Side-to-Side) | | **RoHS Status** | Compliant | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **06A**: Series/Designation (superGRIP high-performance series). * **84**: Specific profile/fin configuration within that series. * **C2**: Material and Finish (typically refers to the Aluminum material and Blue Anodized finish). * **R0**: Version/Revision number. --- ### 3. Key Electronic Components & Features #### A. Attachment Mechanism (superGRIP™) One of the primary "electronic" benefits of this part is the **clip-on mechanism**. * It uses a plastic frame clip that snaps onto the component perimeter. * It utilizes a **stainless steel spring clip** to provide constant pressure. * **Advantage:** No holes are required in the Printed Circuit Board (PCB), saving valuable routing space. #### B. Thermal Interface Material (TIM) The "C2" variant typically comes pre-applied with high-performance thermal tape or a phase-change material. This ensures: * Minimal air gaps between the chip and the heat sink. * Efficient heat transfer from the silicon die to the aluminum fins. #### C. Aerodynamics The **straight fin design** is optimized for systems with high-velocity airflow (measured in Linear Feet per Minute - LFM). The spacing between the fins is engineered to prevent "pressure drop" while maximizing the surface area exposed to the air. --- ### 4. Typical Applications This heat sink is commonly found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power regulators.