ATS-06A-91-C2-R0
AI

The **ATS-06A-91-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their high-performance "maxiFLOW" heat sink series designed for thermal management of semiconductors.
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### 1. Technical Specifications
This part is a high-aspect-ratio heat sink designed for components like CPUs, GPUs, or high-power ASICs.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Thermal Resistance** | ~5.38 °C/W @ 200 LFM |
| **Dimensions (L x W x H)** | 40mm x 40mm x 10mm |
| **Attachment Style** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Straight Fin / maxiFLOW™ |
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### 2. Breakdown of the Part Number
The alphanumeric code follows a specific naming convention used by ATS to identify the physical and thermal properties of the unit:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **06A** | Series Designation (pushPIN™ attachment family) |
| **91** | Specific Heat Sink Geometry/Size (40x40mm) |
| **C2** | Thermal Performance/Material Grade (Blue Anodized) |
| **R0** | Revision code or Packaging identifier |
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### 3. Key Electronic Components & Features
* **pushPIN™ Attachment:** The "06A" series utilizes a specialized spring-loaded mechanism. This ensures even pressure across the electronic chip (TIM - Thermal Interface Material), which is critical for preventing mechanical stress or cracking on delicate silicon dies.
* **maxiFLOW™ Geometry:** The fins are designed with a tapered "flared" profile. In electronics, this reduces air pressure drop and increases the surface area, allowing more heat to be carried away by the cooling fans.
* **Thermal Interface Material (TIM):** Most versions of this part come pre-applied with high-performance thermal tape or grease (like T766), ensuring a low-resistance path for heat to move from the chip to the aluminum.
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### 4. Application Examples
This part is commonly found in:
1. **Networking Hardware:** Routers, switches, and base stations.
2. **Industrial PCs:** Compact systems where vertical space (10mm height) is limited.
3. **Power Supplies:** Cooling MOSFETs or power conversion ICs.
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How do I calculate the airflow requirements for this heat sink?
- ⤷ What are the advantages of pushPIN versus adhesive mounting?
- ⤷ Are there copper versions of the ATS-06A series?