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  • ATS-06A-91-C2-R0

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    The **ATS-06A-91-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their high-performance "maxiFLOW" heat sink series designed for thermal management of semiconductors. --- ### 1. Technical Specifications This part is a high-aspect-ratio heat sink designed for components like CPUs, GPUs, or high-power ASICs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Thermal Resistance** | ~5.38 °C/W @ 200 LFM | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Attachment Style** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin / maxiFLOW™ | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by ATS to identify the physical and thermal properties of the unit: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06A** | Series Designation (pushPIN™ attachment family) | | **91** | Specific Heat Sink Geometry/Size (40x40mm) | | **C2** | Thermal Performance/Material Grade (Blue Anodized) | | **R0** | Revision code or Packaging identifier | --- ### 3. Key Electronic Components & Features * **pushPIN™ Attachment:** The "06A" series utilizes a specialized spring-loaded mechanism. This ensures even pressure across the electronic chip (TIM - Thermal Interface Material), which is critical for preventing mechanical stress or cracking on delicate silicon dies. * **maxiFLOW™ Geometry:** The fins are designed with a tapered "flared" profile. In electronics, this reduces air pressure drop and increases the surface area, allowing more heat to be carried away by the cooling fans. * **Thermal Interface Material (TIM):** Most versions of this part come pre-applied with high-performance thermal tape or grease (like T766), ensuring a low-resistance path for heat to move from the chip to the aluminum. --- ### 4. Application Examples This part is commonly found in: 1. **Networking Hardware:** Routers, switches, and base stations. 2. **Industrial PCs:** Compact systems where vertical space (10mm height) is limited. 3. **Power Supplies:** Cooling MOSFETs or power conversion ICs.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the airflow requirements for this heat sink?
    • ⤷ What are the advantages of pushPIN versus adhesive mounting?
    • ⤷ Are there copper versions of the ATS-06A series?