The **ATS-06A-95-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Finish** | Blue Anodized | --- ### 2. Key Electronic & Mechanical Parts #### A. The Heatsink Body (Heat Dissipator) The core component is made of **extruded aluminum**. Aluminum is chosen for its high thermal conductivity and light weight. The "Straight Fin" design is optimized for environments with consistent airflow (forced convection), allowing heat to move from the electronic chip surface into the surrounding air. #### B. The Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a mechanical **Push-Pin and Spring** system: * **Plastic Push-Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** These provide a precise amount of "downward force" (pressure) to ensure the heatsink remains in firm contact with the electronic component, accounting for vibrations or thermal expansion. #### C. Thermal Interface Material (TIM) The base of the ATS-06A-95-C2-R0 comes pre-applied with **T766 thermal grease/pad**. * **Function:** It fills microscopic air gaps between the electronic component's package and the heatsink base. * **Benefit:** Since air is a poor conductor of heat, the TIM significantly reduces thermal resistance, preventing the electronic part from overheating. --- ### 3. Application Use Cases This part is commonly found in the following electronic systems: 1. **Networking Hardware:** Routers, switches, and high-speed modems. 2. **Embedded Computing:** Industrial PC boards and Single Board Computers (SBCs). 3. **Power Supplies:** Cooling voltage regulators or power transistors. ---