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  • ATS-06A-96-C2-R0

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    The **ATS-06A-96-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed specifically to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06A-96-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Attachment Method** | "pushPIN" Spring Kit | | **Thermal Resistance** | 5.63°C/W (at 1.0 m/s airflow) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Components #### A. The maxiFLOW™ Fin Pattern The ATS-06A-96-C2-R0 uses a unique "flared" fin design. Unlike standard straight-fin heat sinks, these fins spread outward. This geometry: * Increases the surface area for heat dissipation. * Reduces pressure drop. * Maximizes performance in "ducted" or constrained airflow environments. #### B. The pushPIN™ Attachment System This part utilizes the ATS proprietary **pushPIN™** system, which includes: * **Compression Springs:** Provides precise pressure to ensure optimal contact with the electronic component (CPU/GPU/ASIC). * **Plastic/Brass Pins:** Standardized holes in the PCB allow for secure mounting without the risk of the heat sink shifting. #### C. Thermal Interface Material (TIM) The heat sink comes with **T766** pre-applied to the base. This is a high-performance phase-change material or grease that fills microscopic air gaps between the heat sink and the chip, significantly lowering thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling: * **Application-Specific Integrated Circuits (ASICs)** * **Field Programmable Gate Arrays (FPGAs)** * **Processors** in telecommunications and networking hardware. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 5.63 | | 400 | 2.0 | 3.06 | | 600 | 3.0 | 2.14 |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN mounting system?
    • ⤷ How does the blue anodized finish impact the thermal performance?
    • ⤷ Is there a low-profile version of the ATS-06A series?