ATS-06A-96-C2-R0
AI

The **ATS-06A-96-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed specifically to provide high thermal performance in environments with constrained airflow.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-06A-96-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm |
| **Attachment Method** | "pushPIN" Spring Kit |
| **Thermal Resistance** | 5.63°C/W (at 1.0 m/s airflow) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Key Design Components
#### A. The maxiFLOW™ Fin Pattern
The ATS-06A-96-C2-R0 uses a unique "flared" fin design. Unlike standard straight-fin heat sinks, these fins spread outward. This geometry:
* Increases the surface area for heat dissipation.
* Reduces pressure drop.
* Maximizes performance in "ducted" or constrained airflow environments.
#### B. The pushPIN™ Attachment System
This part utilizes the ATS proprietary **pushPIN™** system, which includes:
* **Compression Springs:** Provides precise pressure to ensure optimal contact with the electronic component (CPU/GPU/ASIC).
* **Plastic/Brass Pins:** Standardized holes in the PCB allow for secure mounting without the risk of the heat sink shifting.
#### C. Thermal Interface Material (TIM)
The heat sink comes with **T766** pre-applied to the base. This is a high-performance phase-change material or grease that fills microscopic air gaps between the heat sink and the chip, significantly lowering thermal resistance.
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### 3. Application Use Cases
This specific heat sink is typically used for cooling:
* **Application-Specific Integrated Circuits (ASICs)**
* **Field Programmable Gate Arrays (FPGAs)**
* **Processors** in telecommunications and networking hardware.
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### 4. Thermal Performance Data
Performance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 200 | 1.0 | 5.63 |
| 400 | 2.0 | 3.06 |
| 600 | 3.0 | 2.14 |
- ⤷
What are the PCB hole requirements for the pushPIN mounting system?
- ⤷ How does the blue anodized finish impact the thermal performance?
- ⤷ Is there a low-profile version of the ATS-06A series?