The **ATS-06A-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other PCB components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Details | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (High Performance Phase Change) | --- ### 2. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the electronic component. Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 15.31 | | **200 LFM** | 4.81 | | **400 LFM** | 3.14 | | **600 LFM** | 2.33 | --- ### 3. Key Electronic/Mechanical Features * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides consistent pressure for better heat transfer and allows for secure mounting in high-vibration environments. * **Straight Fin Design:** This design is optimized for environments where there is a clear, directional airflow (forced convection). The gaps between fins reduce the pressure drop, allowing air to pass through efficiently. * **Blue Anodization:** Beyond aesthetics, the anodized coating provides electrical insulation and improves corrosion resistance, which is vital for long-term reliability in electronic enclosures. * **Pre-applied TIM:** The "C2" in the part number indicates it comes with a pre-applied thermal interface material (T766), ensuring a low-resistance thermal path between the chip and the heat sink without needing manual paste application. --- ### 4. Typical Applications * **Processors/FPGAs:** Cooling high-speed logic devices on PCBs. * **Telecommunications:** Used in routers and switches. * **Industrial Power Supplies:** Cooling MOSFETs or power regulators.