The **ATS-06B-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) and other heat-generating components. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06B-02-C2-R0 | | **Heat Sink Type** | PushPIN™ - Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 18.32 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 3.12 °C/W @ 600 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## Electronic & Physical Design Components ### 1. Thermal Management Properties The primary "electronic" function of this part is to dissipate thermal energy away from a semiconductor device (like a CPU, GPU, or FPGA). - **Conduction:** The aluminum base absorbs heat from the component package via the **T766 thermal interface material**. - **Convection:** The straight fins increase the surface area, allowing airflow (natural or forced) to carry heat away into the ambient environment. ### 2. Physical Dimensions Precision sizing is critical for PCB layout and clearance from surrounding surface-mount devices (SMDs). - **Length/Width:** 40.00 mm x 40.00 mm - **Height:** 12.70 mm - **Hole Spacing:** 45.00 mm (diagonal spacing for mounting) ### 3. Attachment Mechanism (pushPIN™) Unlike adhesive-based heatsinks, the ATS-06B-02-C2-R0 uses a mechanical attachment system: - **Push Pins:** Typically made of brass or plastic with a compression spring. - **Springs:** Ensure constant, calibrated pressure (preload) between the heatsink and the electronic component, which optimizes the thermal contact and prevents damage during vibration. --- ## Application Use Cases * **BGA Cooling:** Ideal for Ball Grid Array (BGA) packages used in networking and telecommunications. * **Embedded Systems:** Used on motherboards where vertical clearance is limited (12.7mm height). * **Power Electronics:** Dissipating heat from high-wattage voltage regulators. ---