The **ATS-06B-04-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs (Printed Circuit Boards). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Mounting Type** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Fin Type** | Fine Pitch (Square Fin) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Thermal Resistance** | ~11.58°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Design Components The part is comprised of several critical electronic-mechanical elements: * **Heat Sink Body:** A square-fin aluminum block designed to maximize surface area for heat dissipation from electronic components like CPUs, GPUs, or FPGAs. * **Push-Pin Attachment:** Features a 2-pin attachment mechanism. These plastic pins are spring-loaded to provide consistent pressure (compression force) against the chip, ensuring optimal thermal contact. * **Thermal Interface Material (TIM):** Pre-applied T766 phase-change material on the base. This fills microscopic air gaps between the heat sink and the electronic component to lower thermal impedance. * **Blue Anodization:** A chemical finish that not only protects the aluminum from corrosion but also slightly increases thermal emissivity. --- ### 3. Application Use Cases This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Thermal management for industrial motherboards. 3. **Power Electronics:** Heat dissipation for high-voltage regulators or transistors. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 11.58 | | 400 | 2.0 | 4.02 | | 600 | 3.0 | 3.07 |