The **ATS-06B-07-C1-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their *pushPIN™* series, designed for efficient cooling of electronic components like CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the device: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance (Unducted)** | 16.97 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.41 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Fin Pitch / Pattern** | Fine Pitch / Straight Fin | --- ### 2. Design Components The "electronic part" assembly consists of four main functional elements: 1. **Heat Sink Body:** A square aluminum block with vertical fins. The straight-fin design is optimized for airflow from a specific direction (ducted or open flow). 2. **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T412** thermal tape or grease, which fills microscopic air gaps between the chip and the heatsink to maximize heat transfer. 3. **pushPIN™ Fasteners:** These are plastic or metal pins with internal springs. They provide a precise "engagement force" (pressure) to ensure the heatsink stays in firm contact with the electronic component. 4. **Compression Springs:** These maintain a consistent load, preventing the heatsink from shifting during mechanical shock or vibration. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **06B:** Series/Frame size. * **07:** Height (12.70mm). * **C1:** Thermal performance/material coating code. * **R0:** Revision or packaging code. --- ### 4. Implementation Example To use this part in a PCB design, you must ensure the board has the correct hole pattern for the pushPIN attachment. ```cpp // Thermal Design Power (TDP) Calculation Example float power_dissipation = 15.0; // Watts float ambient_temp = 25.0; // Celsius float thermal_resistance = 2.41; // °C/W (Ducted flow) float junction_temp = ambient_temp + (power_dissipation * thermal_resistance); // Result: 61.15°C (Within safe operating limits for most ICs) ```