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  • ATS-06B-07-C3-R0

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    The **ATS-06B-07-C3-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their high-performance "maxiFLOW™" heat sink series. --- ### 1. Component Overview The ATS-06B-07-C3-R0 is an **Active/Passive Heat Sink** designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, or power modules. It is characterized by its unique "flared fin" design which improves airflow and thermal performance. ### 2. Technical Specifications Below are the primary physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Blue Anodized Aluminum | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Type** | Flared Fin (maxiFLOW™) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 1.76 °C/W (at 200 LFM) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 3. Key Electronic/Mechanical Features #### A. Flared Fin Design Unlike traditional straight-fin heat sinks, the flared fins increase the surface area for cooling while reducing the pressure drop across the heat sink. This is critical in electronics where space is tight and airflow is restricted. #### B. pushPIN™ Attachment This part utilizes a specific mounting mechanism: * **Ease of Assembly:** It uses a spring-loaded pin that clicks into pre-drilled holes in the Printed Circuit Board (PCB). * **Consistent Pressure:** Ensures the heat sink maintains firm, even contact with the chip for maximum heat transfer. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**, a high-performance phase-change material. This fills the microscopic air gaps between the component (the chip) and the heat sink, significantly reducing thermal resistance. --- ### 4. Part Number Breakdown Understanding the suffix codes: * **-06:** Series/Size indicator. * **-07:** Specific height/configuration. * **-C3:** Refers to the Blue Anodized finish and material grade. * **-R0:** Revision status or standard packaging indicator.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN mounting system?
    • ⤷ How does the flared fin design compare to straight fin heat sinks in low-airflow environments?
    • ⤷ Can this heat sink be used with custom thermal pads instead of the pre-applied T412?