The **ATS-06B-08-C3-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic systems. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Push-Pin (Straight Fin) | | **Thermal Resistance** | 14.61° C/W (Natural Convection) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Attachment Method** | Push-Pin with Springs | | **Thermal Interface Material** | T412 (Phase Change Material) | --- ### 2. Detailed Part Breakdown #### A. Thermal Performance The "C3" designation typically refers to a specific performance tier within the ATS product line. This heat sink is optimized for high-density electronic packaging. * **Low Airflow:** It is designed to work efficiently in low-velocity airflow environments. * **Thermal Resistance:** As airflow increases (measured in LFM - Linear Feet per Minute), the thermal resistance drops significantly, allowing for more heat dissipation. #### B. Mechanical Attachment (Push-Pin) Unlike adhesive-based heat sinks, the ATS-06B-08-C3-R0 uses a **Push-Pin** mounting system: * **Reliability:** Provides constant pressure on the processor/chip, ensuring consistent contact with the Thermal Interface Material (TIM). * **Durability:** The pins are usually made of brass or plastic with a stainless steel spring to resist mechanical shock and vibration. * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**. This is a high-performance thermal tape/wax that fills the microscopic air gaps between the chip surface and the heat sink base, maximizing heat transfer. --- ### 3. Common Applications This specific size and thermal profile make it ideal for: 1. **BGA (Ball Grid Array) Components:** Large processors or FPGAs. 2. **Telecommunications:** Networking switches and routers. 3. **Industrial PC:** Embedded systems that require passive or semi-active cooling. 4. **Power Supplies:** Cooling voltage regulators or power transistors. ---