The **ATS-06B-09-C2-R0** is a specific part number for a high-performance thermal management solution manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their **blueICE™** or **push-pin** heat sink series, designed primarily for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table breaks down the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 10.58°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 20.00mm | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a structured nomenclature that describes the heat sink's physical attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **06B**: Part series (identifies the fin geometry and base design). * **09**: Specific height/design iteration (20mm height in this case). * **C2**: Color and Finish (C2 typically indicates a Blue Anodized finish). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Cooling Features #### High-Performance Fin Design The heat sink utilizes a **cross-cut** or **straight fin** geometry (depending on the specific revision) optimized for "impingement" cooling. This maximizes surface area for heat dissipation while maintaining a low profile. #### Mechanical Attachment Instead of using messy adhesives or thermal tape, the **R0** variant uses a **push-pin and spring mechanism**. This offers several advantages for electronics: 1. **Reliable Pressure:** Ensures consistent contact between the component and the heat sink. 2. **Vibration Resistance:** Suitable for environments with mechanical shock. 3. **Removability:** Can be removed for maintenance or component replacement without damaging the PCB. #### Thermal Interface Material (TIM) The unit comes pre-applied with **T766**, a high-performance phase-change material. This fills the microscopic air gaps between the component die and the aluminum base, significantly reducing thermal impedance. --- ### 4. Ideal Applications This part is commonly found in: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial PCs:** Where passive or forced-air cooling is required in tight spaces. * **Power Supplies:** Cooling MOSFETs or power regulators.