The **ATS-06B-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Fin Pattern** | COARSE-PITCH | | **Fin Type** | XCUT | | **Thermal Resistance** | 18.74°C/W (at 100 LFM) | --- ### Key Component Features #### 1. pushPIN™ Attachment System This part utilizes a specific attachment mechanism called **pushPIN™**. It consists of: * **Flexible Springs:** Provide precise pressure to ensure optimal contact with the component. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. * **Ease of Install:** Allows for quick, tool-free installation in high-volume manufacturing. #### 2. Fin Geometry (XCUT) The "XCUT" fin design refers to the way the aluminum fins are shaped. Unlike straight-line fins, XCUT patterns are optimized for **omnidirectional airflow**. This means the heat sink performs well regardless of which direction the cooling fan is blowing across the board. #### 3. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides increased surface area at a microscopic level and protects the aluminum from corrosion and electrical shorting. #### 4. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a **pre-applied Thermal Interface Material** (usually a high-performance phase-change material or grease). This ensures a low thermal resistance path between the electronic chip and the heat sink base. --- ### Application Usage This specific heat sink is categorized as a "Low Profile" solution (only 10mm high). It is commonly found in: * **Network Switches/Routers:** Where vertical space is limited. * **Embedded Systems:** Industrial PCs with tight enclosures. * **Power Supplies:** To cool MOSFETs or Voltage Regulators.