The **ATS-06B-128-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.91°C/W @ 100 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ (Spring-loaded attachment) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Features #### A. pushPIN™ Attachment System The "R0" suffix indicates the inclusion of the **pushPIN™** system. This is a pre-assembled attachment mechanism that includes: * **Brass Springs:** Ensures consistent pressure (Force) across the thermal interface. * **Plastic/Metal Push Pins:** Allows for tool-free or rapid installation into pre-drilled PCB holes. #### B. Thermal Interface Material (TIM) * The unit typically comes pre-applied with a **Thermal Interface Material**, which fills the microscopic air gaps between the heat sink base and the electronic component (die). This ensures maximum heat transfer efficiency. #### C. Fin Design (Heat Dissipation) * The heat sink utilizes a **straight-fin** geometry. This design is optimized for "forced air" cooling environments (where a fan is present). The vertical fins provide a high surface area to volume ratio, allowing air to flow through the channels and carry heat away. --- ### 3. Dimensional Analysis Understanding the footprint is critical for PCB layout and mechanical clearance: * **Height (25.00mm):** This is a medium-profile heat sink. It may interfere with components in ultra-compact (1U) server chassis but fits well in standard desktop or industrial enclosures. * **Footprint (54mm x 54mm):** Designed for large integrated circuits or multi-chip modules. --- ### 4. Thermal Performance Comparison Thermal resistance measures how effectively the part moves heat. Lower numbers are better. | Airflow Rate (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 2.91 | | 300 | 1.5 | 1.48 | | 500 | 2.5 | 1.18 |