The **ATS-06B-134-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.44°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Brass, Spring Loaded) | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 15.00mm | | **Weight** | 120 grams | --- ### 2. Key Design Features * **Fin Profile:** This model features a **Cross-Cut** or **Straight-Fin** design. This allows for multi-directional airflow, making it versatile for different fan orientations within an enclosure. * **pushPIN™ Attachment:** Instead of messy adhesives or thermal tape, this part uses a mechanical push-pin system. This provides consistent pressure across the interface for optimal heat transfer. * **Phase Change Material (TIM):** It typically comes with a pre-applied Thermal Interface Material (T766) to ensure there are no air gaps between the component and the heat sink. * **Low Profile:** At only 15mm in height, it is specifically intended for slim electronic assemblies or 1U server racks where vertical space is limited. --- ### 3. Thermal Performance Analysis Thermal resistance measures how effectively the part moves heat. Lower values indicate better cooling performance. | Airflow (LFM) | Velocity (m/s) | Resistance (Unducted) | Resistance (Ducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 4.44 °C/W | 3.10 °C/W | | 300 | 1.5 | 2.06 °C/W | 1.62 °C/W | | 500 | 2.5 | 1.54 °C/W | 1.35 °C/W | --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs or ASICs in telecommunications. * **Power Supplies:** Heat dissipation for high-voltage converters. * **Embedded Systems:** Industrial PCs where mechanical stability is required via the push-pin mount.