The **ATS-06B-17-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. Contrary to complex integrated circuits, this part is a high-performance **Heat Sink** designed for thermal management in electronic assemblies. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions to define its dimensions and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 35.00mm x 35.00mm | | **Height (Fin)** | 12.00mm | | **Thermal Resistance** | 15.44°C/W (at 100 LFM) | --- ### 2. Design Characteristics This component is designed to dissipate heat from surface-mount devices (SMDs) like CPUs, GPUs, or FPGAs. * **Fin Style:** It features a **Straight Fin** design, which is optimized for airflow directed through the fins. * **Push-Pin Mounting:** This model uses a push-pin mechanism with a brass or plastic pin and a stainless steel spring. This ensures consistent pressure (approx. 20psi) between the heat sink and the chip for maximum heat transfer. * **Thermal Interface Material (TIM):** It typically comes with **T766** pre-applied thermal phase-change material to fill microscopic gaps between the heat sink and the electronic component. --- ### 3. Part Number Breakdown Understanding the suffix helps in identifying the exact variant: * **-06B:** Indicates the specific series and physical footprint. * **-17:** Represents the height of the heatsink (12mm in this specific line). * **-C2:** Refers to the thermal performance and material grade (Aluminum). * **-R0:** Indicates the RoHS compliance status and revision. --- ### 4. Application Use Cases 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. 3. **Power Electronics:** Managing heat for voltage regulators and power modules.