The **ATS-06B-173-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.0mm x 30.0mm x 30.0mm | | **Fin Type** | Square-Cut (Cross-cut) | | **Mounting Style** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~4.72°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Key Electronic & Design Components #### A. Thermal Interface Material (TIM) The "R0" suffix in the part number indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. * **Function:** This material fills the microscopic air gaps between the heat sink base and the electronic component, significantly reducing thermal resistance. #### B. Mounting Hardware (Push Pins) This part utilizes a mechanical attachment system rather than adhesive tape. * **Plastic Push Pins:** Designed to fit into pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** These ensure a consistent and precise amount of downward pressure (clamping force) on the chip, preventing damage while maintaining optimal thermal contact. #### C. Fin Geometry The "Square-Cut" or cross-cut design allows for **multi-directional airflow**. In complex electronic enclosures where the direction of the cooling fan's air might be unpredictable or turbulent, this design ensures the heat sink can dissipate heat effectively from any angle. --- ### 3. Common Applications This specific size and thermal rating are typically used for: * **BGA (Ball Grid Array) Components:** High-speed networking chips or FPGAs. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Embedded Systems:** Industrial PCs where vertical space (30mm) is available for cooling.