The **ATS-06B-188-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for efficient cooling of surface-mount components like BGA (Ball Grid Array) chips. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Thermal Resistance** | 6.67°C/W (Unducted Flow @ 200 LFM) | --- ### Key Features #### 1. Heat Sink Design * **Material:** Made of aluminum for optimal weight-to-thermal conductivity ratio. * **Fin Style:** It features a **Straight-Fin** design. This is ideal for systems with high-velocity airflow or forced-air cooling. * **Anodization:** The blue anodized finish provides a durable surface that prevents corrosion and enhances thermal radiation properties. #### 2. Mounting Mechanism (Push-Pin) * The **Push-Pin** system uses a spring-loaded mechanism to provide a secure and consistent downward force (pressure) on the electronic component. * This ensures maximum contact between the chip and the heat sink, minimizing thermal resistance. * The pins require pre-drilled holes in the PCB. #### 3. Thermal Interface Material (TIM) * The unit comes with **T766** pre-applied to the base. * T766 is a phase-change material that softens when it reaches operating temperature, filling microscopic gaps between the heat sink and the component to improve heat transfer. --- ### Common Applications This part is typically found in: * **Telecommunications:** Cooling of high-speed processors or network switches. * **Industrial Electronics:** Protecting power modules or ASICs from overheating. * **Computing:** Used on Motherboards or Graphics cards for secondary chipsets.