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  • ATS-06B-193-C2-R0

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    The **ATS-06B-193-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components like CPUs, GPUs, and other high-heat surface mount devices. --- ## 1. Technical Specifications The part number encodes specific data about the physical and thermal properties of the heat sink. | Parameter | Specification | Details | | :--- | :--- | :--- | | **Material** | Aluminum | Lightweight with good thermal conductivity. | | **Finish** | Blue Anodized | Protects against corrosion and increases emissivity. | | **Dimensions** | 40mm x 40mm | Footprint size. | | **Height** | 10mm | Low profile for tight vertical spaces. | | **Fin Type** | Fine Pitch | Maximizes surface area for airflow. | | **Attachment** | pushPIN™ | Uses a spring-loaded pin for consistent pressure. | | **Thermal Resistance** | Variable | Depends on airflow (LFM). | --- ## 2. Key Features and Components ### A. Thermal Interface Material (TIM) * **Pre-applied:** This specific model typically comes with **T766** thermal interface material. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic component to ensure maximum heat transfer. ### B. pushPIN™ Attachment System This is the mechanical part that secures the heat sink to the PCB: * **Compression Springs:** Ensure that even pressure is applied across the component, preventing damage while maintaining thermal contact. * **Hardware:** Available in brass or plastic pins; the "R0" suffix indicates the specific kit/packaging version. ### C. Fin Design * The fins are designed for **straight-line airflow**. * The high fin density (Fine Pitch) makes it ideal for systems with forced-air cooling (fans) rather than passive cooling. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in selecting the right variant: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **06:** Series/Attachment type. * **B:** Material (Aluminum). * **193:** Specific geometry/fin configuration. * **C2:** Thermal Interface Material and Finish code (Blue Anodized). * **R0:** Revision/Packaging code. --- ### Summary of Performance The ATS-06B-193-C2-R0 is optimized for **low-profile applications** where space is limited but thermal loads are high. It is commonly found in networking equipment, telecommunications, and industrial computing modules.
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance value of this heat sink at 200 LFM airflow?
    • ⤷ Are there alternative attachment methods if the PCB does not have pushPIN holes?
    • ⤷ How does the 'Blue Anodized' finish affect the heat dissipation compared to a plain finish?