ATS-06B-193-C2-R0
AI

The **ATS-06B-193-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components like CPUs, GPUs, and other high-heat surface mount devices.
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## 1. Technical Specifications
The part number encodes specific data about the physical and thermal properties of the heat sink.
| Parameter | Specification | Details |
| :--- | :--- | :--- |
| **Material** | Aluminum | Lightweight with good thermal conductivity. |
| **Finish** | Blue Anodized | Protects against corrosion and increases emissivity. |
| **Dimensions** | 40mm x 40mm | Footprint size. |
| **Height** | 10mm | Low profile for tight vertical spaces. |
| **Fin Type** | Fine Pitch | Maximizes surface area for airflow. |
| **Attachment** | pushPIN™ | Uses a spring-loaded pin for consistent pressure. |
| **Thermal Resistance** | Variable | Depends on airflow (LFM). |
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## 2. Key Features and Components
### A. Thermal Interface Material (TIM)
* **Pre-applied:** This specific model typically comes with **T766** thermal interface material.
* **Function:** It fills microscopic air gaps between the heat sink base and the electronic component to ensure maximum heat transfer.
### B. pushPIN™ Attachment System
This is the mechanical part that secures the heat sink to the PCB:
* **Compression Springs:** Ensure that even pressure is applied across the component, preventing damage while maintaining thermal contact.
* **Hardware:** Available in brass or plastic pins; the "R0" suffix indicates the specific kit/packaging version.
### C. Fin Design
* The fins are designed for **straight-line airflow**.
* The high fin density (Fine Pitch) makes it ideal for systems with forced-air cooling (fans) rather than passive cooling.
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## 3. Part Number Breakdown
Understanding the nomenclature helps in selecting the right variant:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **06:** Series/Attachment type.
* **B:** Material (Aluminum).
* **193:** Specific geometry/fin configuration.
* **C2:** Thermal Interface Material and Finish code (Blue Anodized).
* **R0:** Revision/Packaging code.
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### Summary of Performance
The ATS-06B-193-C2-R0 is optimized for **low-profile applications** where space is limited but thermal loads are high. It is commonly found in networking equipment, telecommunications, and industrial computing modules.
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What is the thermal resistance value of this heat sink at 200 LFM airflow?
- ⤷ Are there alternative attachment methods if the PCB does not have pushPIN holes?
- ⤷ How does the 'Blue Anodized' finish affect the heat dissipation compared to a plain finish?