ATS-06B-202-C2-R0
AI

The **ATS-06B-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components.
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### 1. Technical Specifications
The following table highlights the physical and thermal characteristics of this specific component:
| Specification | Details |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions** | 50mm x 50mm x 15mm |
| **Thermal Resistance (Unducted)** | 14.83 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 2.85 °C/W @ 100 LFM |
| **Pin Pattern** | Fine Pitch (Cross-Cut) |
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### 2. Breakdown of the Part Number
Understanding the nomenclature helps in identifying the specific configuration:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **06**: Series identifier.
* **B**: Aluminum material.
* **202**: Dimensional code (Length/Width/Height).
* **C2**: Thermal Interface Material (TIM) included (T766 Phase Change Material).
* **R0**: RoHS compliance and revision status.
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### 3. Key Electronic Functions
While the heat sink itself is a passive mechanical part, its role in an electronic system is critical:
1. **Heat Dissipation:** It increases the surface area of high-heat components (like CPUs, GPUs, or MOSFETs), allowing for more efficient heat transfer to the surrounding air.
2. **Thermal Protection:** By maintaining lower operating temperatures, it prevents "thermal throttling" and extends the lifespan of the semiconductor device it covers.
3. **Mechanical Stability:** The `pushPIN` mechanism ensures consistent pressure across the surface, which is vital for the Thermal Interface Material (TIM) to work effectively.
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### 4. Mounting Mechanism
The **pushPIN™** system used in this part features a flexible attachment method:
* **Springs:** Pre-assembled with a compression spring for precise attachment force.
* **Push Pins:** Available in brass or plastic to secure the sink to the PCB through pre-drilled holes.
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What is the difference between ducted and unducted thermal resistance?
- ⤷ What type of Thermal Interface Material (TIM) is used in the C2 variant?
- ⤷ How do I calculate the required airflow for this heat sink?