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  • ATS-06B-202-C2-R0

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    The **ATS-06B-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of this specific component: | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 50mm x 50mm x 15mm | | **Thermal Resistance (Unducted)** | 14.83 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.85 °C/W @ 100 LFM | | **Pin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps in identifying the specific configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **06**: Series identifier. * **B**: Aluminum material. * **202**: Dimensional code (Length/Width/Height). * **C2**: Thermal Interface Material (TIM) included (T766 Phase Change Material). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic system is critical: 1. **Heat Dissipation:** It increases the surface area of high-heat components (like CPUs, GPUs, or MOSFETs), allowing for more efficient heat transfer to the surrounding air. 2. **Thermal Protection:** By maintaining lower operating temperatures, it prevents "thermal throttling" and extends the lifespan of the semiconductor device it covers. 3. **Mechanical Stability:** The `pushPIN` mechanism ensures consistent pressure across the surface, which is vital for the Thermal Interface Material (TIM) to work effectively. --- ### 4. Mounting Mechanism The **pushPIN™** system used in this part features a flexible attachment method: * **Springs:** Pre-assembled with a compression spring for precise attachment force. * **Push Pins:** Available in brass or plastic to secure the sink to the PCB through pre-drilled holes.
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance?
    • ⤷ What type of Thermal Interface Material (TIM) is used in the C2 variant?
    • ⤷ How do I calculate the required airflow for this heat sink?