The **ATS-06B-33-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application characteristics. ### 1. Technical Specifications The part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Fin Type** | Straight Fin | | **Dimensions** | 35mm x 35mm x 20mm | | **Thermal Resistance** | 17.50°C/W (at 100 LFM) | --- ### 2. Physical Design and Construction This component is designed to maximize surface area for heat dissipation: * **Fin Pattern:** It uses a **Straight Fin** design, which is optimal for steady, unidirectional airflow. * **Base Material:** Made of aluminum for a balance between weight, cost, and high thermal conductivity. * **Attachment:** The `pushPIN™` system ensures consistent pressure between the heatsink and the electronic chip, which is vital for effective thermal transfer. --- ### 3. Electronic Application & Performance In an electronic system, this part serves as the primary cooling mechanism for components such as CPUs, GPUs, FPGAs, or Power Transistors. #### Thermal Performance Table The efficiency of the heatsink depends heavily on the velocity of the air (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 17.50 | | 200 | 1.0 | 7.67 | | 400 | 2.0 | 3.63 | | 600 | 3.0 | 2.59 | #### Why "C3" and "R0" Matter? * **C3:** Refers to the thermal interface material (TIM) or the specific hardware kit version. In this series, it often denotes a specific spring/plastic pin combination for PCB mounting. * **R0:** Indicates the RoHS compliance status (Restriction of Hazardous Substances), meaning it is lead-free and safe for global electronic manufacturing standards. --- ### 4. Implementation Example If you are designing a PCB, you would use the following footprint considerations: ```markdown Pitch: 40.00 mm (Distance between mounting holes) Height: 20.00 mm (Vertical clearance required in the chassis) Weight: ~25-30 grams (Mechanical stress on the PCB) ```