The **ATS-06B-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height** | 10.00 mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 26.55 °C/W (Unducted @ 1.0 m/s) | | **Flow Pattern** | Straight-Fin | --- ### 2. Key Components & Design The "Electronic Parts" aspect of this assembly refers to the mechanical interface and the thermal interface material used to protect electronic circuits. * **Heat Sink Body:** Extruded aluminum designed with a fine-pitch fin structure. This maximizes surface area, allowing heat to transfer from the electronic chip to the surrounding air more effectively. * **pushPIN™ Attachment:** This is the mounting mechanism. It uses a flexible, spring-loaded pin that provides a precise amount of "clamping force" (pressure) onto the electronic component. This ensures the heat sink stays in contact with the chip during vibrations or thermal expansion. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412**, a high-performance thermal tape or grease. This fills the microscopic air gaps between the chip and the heat sink to ensure maximum heat conductivity. * **Compression Springs:** These are crucial for maintaining consistent pressure, preventing the heat sink from tilting and potentially cracking the delicate silicon die of the electronic part. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific variant: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **06:** Series/Type. * **B:** Attachment version. * **49:** Physical dimensions/configuration code. * **C3:** Material/Thermal performance grade. * **R0:** RoHS compliance and revision status. --- ### 4. Application in Electronics This part is commonly found in: 1. **Telecommunications:** Cooling signal processors. 2. **Embedded Systems:** Industrial PCs where space is limited (10mm height). 3. **Power Electronics:** Dissipating heat from voltage regulators or MOSFETs.