The **ATS-06B-52-C3-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount chips. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) with Spring | | **Dimensions** | 35mm x 35mm x 25mm | | **Thermal Resistance** | 10.88°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Base Shape** | Square | --- ### 2. Physical Design & Features * **Fin Structure:** It utilizes a straight-fin design, which is optimal for unidirectional airflow environments (e.g., inside a server chassis or a desktop PC case). * **Push Pin Mechanism:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This provides consistent pressure for better thermal contact and is more reliable in high-vibration environments. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or a phase-change material to ensure efficient heat transfer from the chip to the aluminum. --- ### 3. Part Number Breakdown The part number can be decoded to understand the specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06** | Product Series (Push Pin Heat Sinks) | | **B** | Material/Process Code | | **52** | Specific Size/Configuration Identifier | | **C3** | Performance/Thermal Interface Class | | **R0** | Revision or Packaging code | --- ### 4. Applications This electronic part is commonly used for: 1. **Network Switches:** Cooling ASICs and processors. 2. **Industrial PCs:** Ensuring thermal stability in compact enclosures. 3. **Power Supplies:** Dissipating heat from power transistors. 4. **Embedded Systems:** Managing heat on SoCs (System on Chips). ---