ATS-06B-56-C2-R0
AI

The **ATS-06B-56-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed to provide thermal management for electronic components such as CPUs, GPUs, and other high-heat integrated circuits.
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## 1. Technical Specifications
The following table highlights the core technical attributes of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm |
| **Thermal Resistance** | 17.72°C/W (Unducted Flow @ 100 LFM) |
| **Fin Style** | Straight (Cross-Cut) |
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## 2. Key Features and Electronic Design
This heat sink utilizes specific design philosophies to maximize cooling efficiency in tight spaces:
### Attachment System: pushPIN™
The "R0" designation refers to the attachment mechanism. It uses a **push-pin and spring** assembly.
* **Precision:** The spring provides a specific "load" or pressure on the chip to ensure maximum surface contact.
* **Compatibility:** Pre-drilled holes in the PCB are required for mounting.
### Material and Finish
* **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves surface emissivity for better radiant heat transfer.
### Thermal Performance (Airflow)
The thermal resistance of this part varies based on the airflow (measured in Linear Feet per Minute - LFM):
* **100 LFM:** 17.72 °C/W
* **400 LFM:** 4.10 °C/W
* **700 LFM:** 2.91 °C/W
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## 3. Comparison with Alternative Cooling
When compared to standard passive heat sinks, the ATS-06B-56-C2-R0 stands out due to its specific fin density:
```python
# Conceptual Thermal Model (Pseudo-logic)
def calculate_temp_rise(power_watts, thermal_resistance):
# Temp Rise = Power (W) * Thermal Resistance (C/W)
return power_watts * thermal_resistance
# Example for ATS-06B-56-C2-R0 at 400 LFM airflow
power = 5 # Component dissipating 5 Watts
resistance = 4.10
rise = calculate_temp_rise(power, resistance)
print(f"Temperature rise over ambient: {rise} Celsius")
```
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- ⤷
What is the difference between the 'C2' and 'C1' designations in the ATS series?
- ⤷ What are the required PCB hole diameters for the push-pin mounting system?
- ⤷ Can this heat sink be used with a thermal adhesive instead of push-pins?