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  • ATS-06B-56-C2-R0

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    The **ATS-06B-56-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed to provide thermal management for electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table highlights the core technical attributes of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance** | 17.72°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight (Cross-Cut) | --- ## 2. Key Features and Electronic Design This heat sink utilizes specific design philosophies to maximize cooling efficiency in tight spaces: ### Attachment System: pushPIN™ The "R0" designation refers to the attachment mechanism. It uses a **push-pin and spring** assembly. * **Precision:** The spring provides a specific "load" or pressure on the chip to ensure maximum surface contact. * **Compatibility:** Pre-drilled holes in the PCB are required for mounting. ### Material and Finish * **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves surface emissivity for better radiant heat transfer. ### Thermal Performance (Airflow) The thermal resistance of this part varies based on the airflow (measured in Linear Feet per Minute - LFM): * **100 LFM:** 17.72 °C/W * **400 LFM:** 4.10 °C/W * **700 LFM:** 2.91 °C/W --- ## 3. Comparison with Alternative Cooling When compared to standard passive heat sinks, the ATS-06B-56-C2-R0 stands out due to its specific fin density: ```python # Conceptual Thermal Model (Pseudo-logic) def calculate_temp_rise(power_watts, thermal_resistance): # Temp Rise = Power (W) * Thermal Resistance (C/W) return power_watts * thermal_resistance # Example for ATS-06B-56-C2-R0 at 400 LFM airflow power = 5 # Component dissipating 5 Watts resistance = 4.10 rise = calculate_temp_rise(power, resistance) print(f"Temperature rise over ambient: {rise} Celsius") ``` ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between the 'C2' and 'C1' designations in the ATS series?
    • ⤷ What are the required PCB hole diameters for the push-pin mounting system?
    • ⤷ Can this heat sink be used with a thermal adhesive instead of push-pins?