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  • ATS-06B-57-C2-R0

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    The **ATS-06B-57-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 40.00mm x 40.00mm | | **Height** | 15.00mm | | **Fin Type** | Fine Pitch (Straight Fins) | | **Thermal Resistance** | 13.16°C/W (Unducted Flow @ 100 LFM) | --- ### Key Components & Features #### 1. Push-Pin Attachment System This part uses a specific **Push-Pin** mechanism (usually brass or plastic) with a stainless steel spring. * **Benefits:** Provides high reliable contact pressure (clamping force) between the heat sink and the electronic chip. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### 2. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **Pre-applied Thermal Interface Material**. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic component to maximize heat transfer. #### 3. Fin Profile (Fine Pitch) The ATS-06B-57-C2-R0 utilizes a "Fine Pitch" design. This increases the surface area available for convection, making it highly efficient in forced-air environments (systems with fans). ### Applications * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Routers, switches, and high-speed modems. * **Power Electronics:** Voltage regulators and power modules. --- ### Comparison of Airflow Efficiency Thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 13.16 | | 300 | 1.5 | 4.42 | | 500 | 2.5 | 3.14 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between blue anodized and black anodized finishes for heat sinks?
    • ⤷ How do I calculate the required hole spacing on the PCB for this heat sink?
    • ⤷ What are the advantages of push-pin mounting over adhesive thermal tape?