ATS-06B-57-C2-R0
AI

The **ATS-06B-57-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
### Technical Specifications
Below are the primary mechanical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Base Dimensions** | 40.00mm x 40.00mm |
| **Height** | 15.00mm |
| **Fin Type** | Fine Pitch (Straight Fins) |
| **Thermal Resistance** | 13.16°C/W (Unducted Flow @ 100 LFM) |
---
### Key Components & Features
#### 1. Push-Pin Attachment System
This part uses a specific **Push-Pin** mechanism (usually brass or plastic) with a stainless steel spring.
* **Benefits:** Provides high reliable contact pressure (clamping force) between the heat sink and the electronic chip.
* **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB).
#### 2. Thermal Interface Material (TIM)
The "R0" suffix typically indicates that the part comes with **Pre-applied Thermal Interface Material**.
* **Function:** It fills microscopic air gaps between the heat sink base and the electronic component to maximize heat transfer.
#### 3. Fin Profile (Fine Pitch)
The ATS-06B-57-C2-R0 utilizes a "Fine Pitch" design. This increases the surface area available for convection, making it highly efficient in forced-air environments (systems with fans).
### Applications
* **Embedded Systems:** Industrial PCs and controllers.
* **Networking:** Routers, switches, and high-speed modems.
* **Power Electronics:** Voltage regulators and power modules.
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### Comparison of Airflow Efficiency
Thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases:
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 13.16 |
| 300 | 1.5 | 4.42 |
| 500 | 2.5 | 3.14 |
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- ⤷What is the difference between blue anodized and black anodized finishes for heat sinks?
- ⤷ How do I calculate the required hole spacing on the PCB for this heat sink?
- ⤷ What are the advantages of push-pin mounting over adhesive thermal tape?