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  • ATS-06B-72-C2-R0

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    The **ATS-06B-72-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series of high-performance heat sinks designed for cooling semiconductors. --- ## 1. Technical Specifications The part number encodes specific data about the physical and thermal properties of the component. | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Pattern** | Straight Fin | | **Thermal Resistance** | 15.90 °C/W (Unducted Flow @ 100 LFM) | --- ## 2. Key Components & Materials ### A. The Heat Sink Body The main body is made from **Aluminum 6063**, which is the industry standard for thermal management due to its high thermal conductivity and lightweight properties. The "Straight Fin" design allows for efficient airflow across the surface area to dissipate heat from the electronic component (CPU, GPU, or FPGA) it is attached to. ### B. The Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, this part uses a mechanical attachment system: * **Pins:** Brass or Plastic pins that go through pre-drilled holes in the PCB. * **Springs:** Compressed springs provide consistent "Normal Force," ensuring the heat sink remains in firm contact with the chip even during mechanical shock or vibration. ### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **pre-applied Thermal Interface Material**. This is a specialized paste or pad located on the base of the heat sink that fills microscopic air gaps between the chip and the metal, significantly improving heat transfer. --- ## 3. Usage Context This part is generally used in the following electronic environments: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where mechanical stability is required. * **Power Supplies:** Cooling voltage regulators or power transistors. ---
    ✨ Follow-up Questions
    • ⤷ How does the 'pushPIN' attachment compare to adhesive thermal tape?
    • ⤷ What is the significance of the 'Blue Anodized' finish on this part?
    • ⤷ How do I calculate if this heat sink's thermal resistance is sufficient for my chip?