ATS-06B-76-C3-R0
AI

The **ATS-06B-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions, Inc. (ATS).
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Description |
| :--- | :--- |
| **Component Type** | Push-Pin Heatsink |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 25mm x 25mm x 15mm |
| **Thermal Resistance** | 27.50° C/W (Natural Convection) |
| **Attachment Method** | Push-Pin (Plastic) with Brass Springs |
| **Thermal Interface (TIM)** | T412 (Pre-applied) |
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## 2. Key Electronic & Mechanical Features
### A. Fin Design (Straight Fin)
The "76" in the part number indicates the specific fin pattern. This model features a **Straight Fin** design, which is optimized for environments where there is a consistent, directional airflow (forced convection).
### B. Attachment Mechanism
Instead of using messy thermal glues or tapes, this part uses a **Push-Pin** system:
* **Ease of Assembly:** Pins snap into pre-drilled holes on the PCB.
* **Consistent Pressure:** The integrated springs ensure uniform contact between the heatsink base and the electronic component (CPU, GPU, or ASIC).
### C. Thermal Interface Material (TIM)
The unit comes with **T412** thermal tape pre-applied to the base. This material fills microscopic air gaps between the heatsink and the chip, significantly improving heat transfer efficiency.
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## 3. Ideal Applications
This heatsink is typically found in the following electronic environments:
* **Networking Gear:** Routers and switches with high-density chipsets.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Electronics:** Voltage regulators and high-speed memory modules.
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## 4. Thermal Performance Comparison
The effectiveness of the ATS-06B-76-C3-R0 depends heavily on airflow velocity (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 4.42 |
| 400 (2.0 m/s) | 2.50 |
| 600 (3.0 m/s) | 1.91 |
| 800 (4.0 m/s) | 1.63 |
- ⤷
How does the blue anodized finish affect the thermal performance compared to bare aluminum?
- ⤷ What are the recommended PCB hole diameters for the push-pin attachment?
- ⤷ Can the T412 interface material be replaced with thermal paste for better performance?