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  • ATS-06B-76-C3-R0

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    The **ATS-06B-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions, Inc. (ATS). --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Component Type** | Push-Pin Heatsink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 27.50° C/W (Natural Convection) | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Thermal Interface (TIM)** | T412 (Pre-applied) | --- ## 2. Key Electronic & Mechanical Features ### A. Fin Design (Straight Fin) The "76" in the part number indicates the specific fin pattern. This model features a **Straight Fin** design, which is optimized for environments where there is a consistent, directional airflow (forced convection). ### B. Attachment Mechanism Instead of using messy thermal glues or tapes, this part uses a **Push-Pin** system: * **Ease of Assembly:** Pins snap into pre-drilled holes on the PCB. * **Consistent Pressure:** The integrated springs ensure uniform contact between the heatsink base and the electronic component (CPU, GPU, or ASIC). ### C. Thermal Interface Material (TIM) The unit comes with **T412** thermal tape pre-applied to the base. This material fills microscopic air gaps between the heatsink and the chip, significantly improving heat transfer efficiency. --- ## 3. Ideal Applications This heatsink is typically found in the following electronic environments: * **Networking Gear:** Routers and switches with high-density chipsets. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-speed memory modules. --- ## 4. Thermal Performance Comparison The effectiveness of the ATS-06B-76-C3-R0 depends heavily on airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 4.42 | | 400 (2.0 m/s) | 2.50 | | 600 (3.0 m/s) | 1.91 | | 800 (4.0 m/s) | 1.63 |
    ✨ Follow-up Questions
    • ⤷ How does the blue anodized finish affect the thermal performance compared to bare aluminum?
    • ⤷ What are the recommended PCB hole diameters for the push-pin attachment?
    • ⤷ Can the T412 interface material be replaced with thermal paste for better performance?