The **ATS-06B-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 10.79°C/W (at 100 LFM) | | **Flow Orientation** | Vertical Fin (High Efficiency) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the cooling capability and mounting style: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **06**: Series identifier (typically relates to mounting hole spacing or fin density). * **B**: Fin type/geometry designation. * **82**: Specific profile identifier for the base and fin height. * **C2**: Material and Finish (Aluminum with Blue Anodized coating). * **R0**: Revision or specific packaging code. --- ### 3. Key Features & Applications #### Features * **High Performance:** The "straight fin" design allows for excellent heat dissipation in environments with directed airflow. * **Secure Mounting:** Uses a **Push-Pin and Spring** mechanism. This ensures consistent pressure between the heat sink and the chip, improving thermal interface material (TIM) performance. * **Pre-drilled Holes:** Designed to fit specific PCB hole patterns, eliminating the need for messy adhesives or clips. * **Thermal Interface Material:** Often comes with pre-applied phase-change material or high-conductivity pads. #### Common Applications * **Processors (CPU/GPU):** Cooling small form-factor embedded processors. * **Network Hardware:** Cooling ASICs in routers and switches. * **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators. * **Industrial PCs:** Used in compact enclosures where passive or low-airflow cooling is required. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 10.79 | | 300 (Moderate) | 3.50 | | 500 (High Flow) | 2.50 | ---