The **ATS-06B-83-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power chipsets. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-06B-83-C2-R0 | | **Thermal Resistance** | 1.62°C/W (at 200 LFM) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass, Plastic) | | **Fin Type** | Cross-Cut (Straight Fin) | | **Dimensions (L x W x H)** | 30mm x 30mm x 20mm | --- ### 2. Key Features and Construction #### A. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just aesthetic; the anodized layer increases surface emissivity, which improves heat dissipation via radiation and protects the metal from corrosion. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the "06B" series uses a mechanical **Push-Pin and Spring** system: * **Reliability:** Provides consistent pressure (Pre-assembled with a spring) to ensure maximum contact between the heat sink and the component. * **Installation:** Requires pre-drilled holes in the PCB. The pins snap into place, locking the heat sink securely. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the part comes pre-applied with **ATS-specific thermal phase change material** or high-performance thermal tape. This fills microscopic air gaps between the component and the heat sink base to lower thermal resistance. --- ### 3. Thermal Performance Profile Thermal resistance indicates how effectively the part moves heat away from the silicon. Performance varies based on the airflow (LFM - Linear Feet per Minute): * **Unducted Flow (100 LFM):** ~3.00°C/W * **Ducted Flow (200 LFM):** ~1.62°C/W * **High Flow (400 LFM):** ~1.20°C/W --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling MOSFETs or power regulators.