The **ATS-06D-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling small electronic components like CPUs, GPUs, or ASICs. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Fin Style** | Straight Fin | | **Dimensions** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 22.05°C/W (at 200 LFM) | | **Compatibility** | 40mm square components | --- ### 2. Key Electronic Functions While the heat sink itself does not contain circuitry, its role is critical to the electronic stability of a system: * **Thermal Dissipation:** It increases the surface area of a heat-generating semiconductor, allowing heat to transfer more efficiently into the surrounding air. * **Preventing Thermal Throttling:** By keeping temperatures low, it ensures that processors do not reduce their clock speeds to prevent overheating. * **Component Longevity:** Excessive heat is the primary cause of electronic failure; this part extends the Mean Time Between Failures (MTBF) of the primary IC. --- ### 3. Attachment Mechanism: Push-Pin & Spring The "C3" in the part number refers to the specific attachment kit included. This system consists of: 1. **Plastic Push-Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). 2. **Compression Springs:** These provide consistent downward pressure on the heat sink, ensuring an airtight interface with the electronic component. 3. **Thermal Interface Material (TIM):** Usually pre-applied as a T766 phase-change material or a thermal pad to fill microscopic gaps between the sink and the chip. --- ### 4. Airflow Performance (LFM) The effectiveness of the ATS-06D-01-C3-R0 is highly dependent on the velocity of the air moving through it (Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 22.05 | | 400 (2.0 m/s) | 13.02 | | 600 (3.0 m/s) | 9.33 | | 800 (4.0 m/s) | 7.25 |