The **ATS-06D-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *pushPIN™* series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Spring-loaded) | | **Thermal Resistance** | 18.32°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 12.70mm | --- ## 2. Design Features The "electronic" functionality of this part is purely passive, relying on thermodynamics to protect active components. ### A. Fin Profile (Fine Pitch) The "D" in the part number often indicates a specific fin pattern. This model uses a **Straight Fin** design, which provides a high surface area to volume ratio, making it ideal for systems with moderate to high airflow. ### B. Thermal Interface Material (TIM) The **C2** suffix indicates that this heat sink comes pre-applied with a high-performance thermal interface material (typically a phase-change or grease-based pad). This ensures the microscopic gaps between the heat sink and the electronic chip are filled, reducing thermal impedance. ### C. Attachment Mechanism (Push Pin) Unlike adhesive-based heat sinks, the **R0** version uses a push-pin mechanism with a brass or plastic pin and a compression spring. * **Reliability:** Provides constant pressure for better thermal contact. * **Maintenance:** Allows for easy removal and re-installation without damaging the PCB. --- ## 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Resistance (Unducted) | Resistance (Ducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 18.32 °C/W | 3.12 °C/W | | 200 | 1.0 | 7.12 °C/W | 2.03 °C/W | | 400 | 2.0 | 4.12 °C/W | 1.47 °C/W | --- ### Summary of Usage This part is typically found on **Printed Circuit Boards (PCBs)** where a specific electronic component is generating between 2W and 15W of heat. The blue anodized coating is not just for aesthetics; it increases surface emissivity and protects the aluminum from corrosion.