The **ATS-06D-05-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine-Pitch | | **Fin Pattern** | XCUT (Cross-cut) | | **Thermal Resistance (Unducted)** | 20.84 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.19 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | --- ### 2. Component Features #### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the pushPIN™ system uses a flexible, spring-loaded mechanism. This ensures: * **Constant Pressure:** Maintains uniform contact between the heat sink and the processor for better heat transfer. * **Secure Mounting:** Resistant to shocks and vibrations. * **Pre-Drilled Holes:** Designed for easy installation into a PCB with a standard hole pattern. #### B. Cross-Cut (XCUT) Fin Design The "XCUT" geometry means the fins are cut in both vertical and horizontal directions. This creates individual square pins rather than long continuous walls. * **Omnidirectional Airflow:** It can receive air from any direction, making it ideal for enclosures with complex airflow patterns. * **Increased Surface Area:** Maximizes the area available for heat dissipation. #### C. Thermal Interface Material (TIM) The **C3** designation in the part number indicates the type of Thermal Interface Material pre-applied to the base. * **T412:** This specific model typically comes with T412, a high-performance phase-change material that fills microscopic air gaps between the chip and the aluminum. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **06D** | Series/Mounting Style (pushPIN™) | | **05** | Fin Pitch/Pattern Specifics | | **C3** | Thermal Interface Material (TIM) Type | | **R0** | RoHS Compliant Version | --- ### 4. Typical Applications * **CPUs & GPUs:** In embedded systems or industrial PCs. * **ASICs & FPGAs:** Used in telecommunications and data processing equipment. * **Power Electronics:** For cooling high-output transistors and voltage regulators.