The **ATS-06D-07-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** series, designed for efficient heat dissipation in compact electronic assemblies. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Fine-Pitch (Straight) | | **Thermal Resistance (Flow)** | 17.09 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.82 °C/W (Unducted) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | --- ### 2. Key Electronic Components #### A. The Heat Sink Body The body is constructed from high-quality aluminum to provide high thermal conductivity. The **Fine-Pitch** fin design maximizes surface area, allowing for rapid heat transfer from the semiconductor (CPU, GPU, or Power MOSFET) to the surrounding air. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or standard screws, this part uses a specialized attachment system: * **Springs:** Pre-assembled brass or steel springs provide precise pressure to ensure optimal contact with the electronic component. * **Push Pins:** Made of nylon or copper, these snap into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates the type of Thermal Interface Material used. This model typically comes with a pre-applied **T766 phase-change material** or a high-performance thermal pad, which fills microscopic air gaps between the chip and the heat sink. --- ### 3. Application Use Cases The ATS-06D-07-C3-R0 is commonly used in: * **Telecommunications:** Cooling high-speed processors in routers and switches. * **Embedded Systems:** Industrial PCs where vertical space (12.7mm height) is limited. * **Power Electronics:** Managing heat for VRMs (Voltage Regulator Modules) and high-current power supplies. --- ### 4. Thermal Performance Comparison | Airflow Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 17.09 | 6.22 | 3.82 | 2.82 |