The **ATS-06D-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance (Flowing Air)** | 2.13°C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 14.61°C/W | | **Thermal Interface Material (TIM)** | T412 (High Performance) | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which offers high thermal conductivity. The **Blue Anodized finish** is not just for aesthetics; it increases surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. #### B. Attachment Mechanism: Push-Pins Unlike adhesive-based heat sinks, the "08" in the part number indicates a specific push-pin configuration. * **Spring-Loaded:** Each pin features a compression spring to provide consistent downward pressure on the electronic component (CPU, GPU, or ASIC). * **Vibration Resistance:** The mechanical locking mechanism makes it suitable for industrial environments where the PCB may be subject to movement. #### C. Thermal Interface Material (TIM) The "C3" designation refers to the pre-applied **T412 thermal tape**. This is a double-sided acrylic adhesive with high dielectric strength and thermal conductivity, ensuring that air gaps between the component and the heat sink are eliminated. --- ### 3. Application Use Cases This specific part is typically used for cooling mid-range heat-generating components: * **Integrated Circuits (ICs):** Large FPGAs or Microprocessors. * **Power Electronics:** High-power transistors or voltage regulators. * **Networking Gear:** Cooling chips in routers, switches, and server blades. --- ### 4. Thermal Performance Comparison Thermal resistance is measured in °C/W (degrees Celsius per Watt). A lower number indicates better cooling. | Airflow Rate (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 2.13 | | 400 | 2.0 | 1.33 | | 600 | 3.0 | 1.07 | ---