ATS-06D-11-C2-R0
AI

The **ATS-06D-11-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic assemblies.
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## 1. Technical Specifications
This part belongs to the **pushPIN™** Heat Sink Assembly series. Below are the primary technical characteristics:
| Property | Description |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 18.74 °C/W (Unducted Flow @100 LFM) |
| **Dimensions** | 50mm x 50mm x 10mm |
| **Fin Type** | XCUT (Cross-cut) |
| **Fin Pitch** | Fine Pitch |
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## 2. Key Features and Components
### A. PushPIN™ Attachment
Unlike adhesive tapes or simple clips, the "R0" version typically uses a **push-pin and spring mechanism**. This ensures:
* **Constant Pressure:** Maintains optimal contact between the heat sink and the processor/component.
* **Reliability:** Resistant to vibration and mechanical shock.
* **Ease of Install:** Quick installation into pre-drilled holes on the PCB.
### B. XCUT Fin Design
The "XCUT" geometry refers to the cross-cut pattern of the aluminum fins. This design is highly effective because:
* It allows for **omni-directional airflow**, meaning the cooling efficiency is less dependent on the direction of the fan or case airflow.
* It increases the surface area for heat dissipation without significantly increasing the footprint.
### C. Thermal Interface Material (TIM)
The "C2" in the part number usually indicates the type of thermal interface material pre-applied to the base.
* **T766:** Typically, ATS-06D-11-C2-R0 comes with a high-performance thermal grease or pad (often T766) to bridge the microscopic air gaps between the heat sink and the electronic chip.
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## 3. Applications
This component is typically used to cool the following electronic parts:
1. **BGA Packages:** Ball Grid Array chips like FPGAs or CPUs.
2. **Power Electronics:** High-heat transistors or voltage regulators.
3. **Telecommunications Gear:** Routers and switches where vertical space (10mm height) is limited.
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- ⤷
What are the alternative attachment methods for ATS heat sinks?
- ⤷ How does the 'C2' thermal material compare to 'C1' or 'C3' versions?
- ⤷ Can this heat sink be used with a specific fan size?