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  • ATS-06D-11-C2-R0

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    The **ATS-06D-11-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic assemblies. --- ## 1. Technical Specifications This part belongs to the **pushPIN™** Heat Sink Assembly series. Below are the primary technical characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 18.74 °C/W (Unducted Flow @100 LFM) | | **Dimensions** | 50mm x 50mm x 10mm | | **Fin Type** | XCUT (Cross-cut) | | **Fin Pitch** | Fine Pitch | --- ## 2. Key Features and Components ### A. PushPIN™ Attachment Unlike adhesive tapes or simple clips, the "R0" version typically uses a **push-pin and spring mechanism**. This ensures: * **Constant Pressure:** Maintains optimal contact between the heat sink and the processor/component. * **Reliability:** Resistant to vibration and mechanical shock. * **Ease of Install:** Quick installation into pre-drilled holes on the PCB. ### B. XCUT Fin Design The "XCUT" geometry refers to the cross-cut pattern of the aluminum fins. This design is highly effective because: * It allows for **omni-directional airflow**, meaning the cooling efficiency is less dependent on the direction of the fan or case airflow. * It increases the surface area for heat dissipation without significantly increasing the footprint. ### C. Thermal Interface Material (TIM) The "C2" in the part number usually indicates the type of thermal interface material pre-applied to the base. * **T766:** Typically, ATS-06D-11-C2-R0 comes with a high-performance thermal grease or pad (often T766) to bridge the microscopic air gaps between the heat sink and the electronic chip. --- ## 3. Applications This component is typically used to cool the following electronic parts: 1. **BGA Packages:** Ball Grid Array chips like FPGAs or CPUs. 2. **Power Electronics:** High-heat transistors or voltage regulators. 3. **Telecommunications Gear:** Routers and switches where vertical space (10mm height) is limited. ---
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods for ATS heat sinks?
    • ⤷ How does the 'C2' thermal material compare to 'C1' or 'C3' versions?
    • ⤷ Can this heat sink be used with a specific fan size?