The **ATS-06D-115-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, designed specifically to manage the thermal profiles of electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06D-115-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 5.33°C/W (at 200 LFM) | | **Flow Pattern** | maxiFLOW (Tapered Fin Design) | --- ### 2. Key Electronic & Design Features #### A. maxiFLOW™ Fin Geometry The "maxiFLOW" design uses a specialized fin profile that increases surface area while reducing pressure drop. This is critical for electronic enclosures where airflow might be restricted. The tapered fins allow for better air intake and heat dissipation from the center of the component. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism known as **pushPIN™**. It includes: * **Flexible Springs:** These ensure precise pressure (Pre-assembled) to maintain optimal contact between the heat sink and the electronic chip. * **Plastic/Brass Pins:** Designed to fit into standard 3mm holes on a Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The **C2** in the part number indicates that the heat sink comes pre-applied with a high-performance **Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a uniform layer that bridges the microscopic air gaps between the semiconductor and the heat sink. --- ### 3. Application Use Cases The ATS-06D-115-C2-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed data processors. 2. **Embedded Systems:** For industrial computers where space is limited but heat output is high. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on air velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 5.33 | | 400 | 3.13 | | 600 | 2.57 | | 800 | 2.27 |