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  • ATS-06D-133-C2-R0

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    The part number **ATS-06D-133-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This specific component is part of their "pushPIN™" thermal management line, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the device: | Feature | Specification | | :--- | :--- | | **Heat Sink Type** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | ~4.11 °C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **06**: Series/Series variation. 3. **D**: Thermal Interface Material (TIM) code. 4. **133**: Specific dimensions and fin configuration. 5. **C2**: Material and Finish (typically refers to Aluminum with Blue Anodize). 6. **R0**: RoHS Compliance status. --- ### 3. Electronic Application & Usage This part is not an "electronic component" in the sense of a semiconductor, but a **passive thermal management component**. Its primary roles include: * **Heat Dissipation:** It increases the surface area of a heat-generating component to allow faster cooling via airflow. * **Mechanical Attachment:** The push-pin mechanism ensures constant pressure between the heat sink and the chip, which is critical for the effectiveness of the Thermal Interface Material (TIM). * **Protection:** By maintaining a lower operating temperature, it prevents "thermal throttling" and extends the lifespan of sensitive electronic circuits. --- ### 4. Thermal Performance Comparison Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 4.11 | 2.19 | 1.66 |
    ✨ Follow-up Questions
    • ⤷ What are the compatible push-pin sizes for this heat sink?
    • ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
    • ⤷ What is the weight of the ATS-06D-133-C2-R0?