The **ATS-06D-14-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 9.97°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Fin Style** | Square Pin Fin | | **Finish** | Blue Anodized | --- ## Key Design Components ### 1. Push-Pin Attachment This part uses a specific **push-pin** mechanism rather than adhesive tape or screws. * **Spring-loaded:** Ensures consistent pressure between the heat sink and the component for optimal heat transfer. * **Easy Installation:** Simplifies PCB assembly without the need for complex mounting hardware. ### 2. Square Pin Fin Geometry The "06D" series utilizes a square pin fin pattern. Unlike traditional straight fins, pin fins: * Increase surface area for radiation and convection. * Allow for multi-directional airflow (omnidirectional), meaning the heat sink performs well regardless of which direction the fan is blowing. ### 3. Material and Coating * **Aluminum Construction:** Offers a balance of lightweight design and high thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves surface emissivity for better radiant heat transfer. ### 4. Thermal Interface Material (TIM) The part number suffix **"C2"** typically indicates the type of pre-applied thermal interface material. * **T766 Phase Change Material:** This is usually pre-applied to the base, ensuring there are no air gaps between the chip and the metal. --- ## Performance Comparison (Airflow) | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.97 | | 300 (1.5 m/s) | 3.85 | | 500 (2.5 m/s) | 2.56 | *Note: Higher airflow (LFM) significantly reduces the thermal resistance, allowing the component to run cooler.*