The **ATS-06D-142-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions, Inc.* It is designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 4.92°C/W (at 100 LFM) | | **Material** | Aluminum | | **Fin Style** | Blue Anodized (Cross-Cut) | | **Attachment Method** | Push-Pin | | **Dimensions** | 30.00mm x 30.00mm x 15.00mm | --- ## Key Components and Features ### 1. The Heat Sink Body The main body is constructed from **Aluminum**, which provides an excellent balance between thermal conductivity and weight. The "Cross-Cut" fin design allows for multi-directional airflow, making it effective even in systems where air direction is inconsistent. ### 2. Push-Pin Attachment Mechanism Instead of using adhesive tapes or complex brackets, this part uses the **pushPIN™** system: * **Spring-loaded pins:** Provide consistent pressure across the interface to maximize heat transfer. * **Brass/Plastic Pins:** Durable fasteners that lock into pre-drilled holes on the PCB. ### 3. Thermal Interface Material (TIM) The "C3" in the part number indicates that it comes with a **pre-applied thermal interface material**. This is a phase-change or grease-like layer on the bottom surface that fills microscopic air gaps between the component and the heat sink. ### 4. Blue Anodized Finish The surface is treated with a blue anodized coating. While primarily aesthetic, anodization provides: * Corrosion resistance. * Improved surface emissivity (slight increase in radiant cooling). * Electrical insulation of the heat sink surface. --- ## Performance in Different Airflows | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.92 | | 300 (1.5 m/s) | 2.11 | | 500 (2.5 m/s) | 1.62 | | 700 (3.5 m/s) | 1.42 | ---