The **ATS-06D-144-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm | | **Height (Off Base)** | 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.93°C/W @ 100 LFM (Airflow) | | **Fin Configuration** | Fine Pitch (Cross-cut) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product line and dimensions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **06**: Series (Typically refers to the pushPIN™ attachment family). * **D**: Material/Configuration code. * **144**: Specific size/geometry identifier. * **C2**: Thermal Interface Material (TIM). "C2" typically indicates **T766** (a high-performance thermal grease). * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Features #### A. pushPIN™ Attachment Unlike adhesive tapes or clip-on heat sinks, this part uses a **push-pin and spring mechanism**. This provides: * **Consistent Pressure:** Ensures optimal contact between the heat sink and the electronic component (CPU, GPU, or FPGA). * **Shock Resistance:** The spring-loaded assembly prevents the heat sink from shifting during mechanical vibration. #### B. Cross-Cut Fin Design The fins are designed with a "cross-cut" pattern. This is an electronic cooling strategy that allows for **multi-directional airflow**. If the air inside an enclosure isn't blowing in a single straight line, the cross-cut design still captures ambient air to dissipate heat efficiently. #### C. Thermal Interface Material (TIM) The "C2" designation means the part comes with **pre-applied thermal grease**. This simplifies the assembly process in manufacturing, as engineers do not need to manually apply paste to the chip before mounting the heat sink. --- ### 4. Typical Applications * **Microprocessors (CPUs):** Small form factor processing units. * **Telecommunications:** Cooling for high-speed networking chips. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where vertical space is limited to 25mm.