The **ATS-06D-151-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Attachment Method** | Push-Pin (Steel) | | **Thermal Resistance** | 3.90°C/W (at 100 LFM) | | **Flow Orientation** | Vertical Fin (Straight) | --- ### 2. Breakdown of the Part Number The nomenclature for ATS products follows a specific coding logic: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **06**: Fin pitch/style configuration. * **D**: Attachment style (Push-pin). * **151**: Unique geometric identifier for size and fin count. * **C1**: Material/Finish code (usually indicates Aluminum with Blue Anodize). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), it is critical for the following electronic functions: 1. **Heat Dissipation:** It increases the surface area of the component (e.g., a BGA chip), allowing air to carry away heat more efficiently. 2. **Thermal Interface:** It is typically paired with a **TIM (Thermal Interface Material)** like thermal grease or a pad to fill microscopic air gaps between the chip and the metal. 3. **Mechanical Stability:** The "Push-Pin" mechanism ensures consistent downward pressure, which is vital for maintaining a solid thermal connection during vibrations or thermal expansion. --- ### 4. Typical Application Circuit Context In a PCB design, you would find this part mounted over a high-heat component: ```yaml Component: FPGA / Microprocessor Maximum Junction Temp: 100°C Ambient Temp: 40°C Required Heat Sink: ATS-06D-151-C1-R0 Mounting Hole Pattern: 30mm x 30mm (approx) ```